Imec Validates High NA Lithography as Essential for Angstrom-Scale Chips
Leuven, Thursday 5 February 2026
Imec demonstrates that High NA EUV resolves critical stochastic failures, replacing complex multi-patterning with single exposures to unlock the angstrom era of semiconductor manufacturing.
The Physics of Simplification
The transition to High Numerical Aperture (High NA) EUV lithography represents a fundamental shift in manufacturing physics, defined by an increase in numerical aperture from 0.33 to 0.55 while maintaining the standard 13.5nm wavelength [1]. This 67 per cent increase in aperture enables a critical reduction in process complexity [1]. Where 0.33 NA lithography requires three to four masks to pattern logic critical metal layers with pitches of 20nm or less, High NA technology achieves this in a single exposure [1]. This capability not only simplifies the process but also enhances image contrast and local CD uniformity (LCDU) by 18 to 42 per cent for 29nm pitch structures, effectively mitigating the stochastic failures that plague multi-patterning approaches [1].
From Lab to Fab: A Timeline of Validation
Imec’s validation of this technology has accelerated rapidly over the last two years. Following the 2024 demonstration of single-print images of 16nm pitch line/spaces on ASML’s TWINSCAN EXE:5000, Imec progressed in 2025 to yielding metallized line structures with 20nm and 18nm pitches using direct metal etch (DME) [1]. Momentum has continued into the current week; on 3 February 2026, Imec released a 14 angstrom Process Design Kit (PDK), a crucial step for chip designers to begin working with these dimensions [2]. These milestones underscore the readiness of the ecosystem for sub-2nm logic nodes, a key objective of the European Chips Act [1].
Ecosystem Dynamics and Market Growth
The industrial scaling of High NA EUV relies on a specialised value chain anchored by ASML, the sole supplier of these lithography systems [3]. The market for EUV lithography is forecast to expand robustly, growing from USD 15.84 billion in 2026 to USD 30.36 billion by 2032, representing a total increase of 91.667 per cent over the period [3]. This growth is supported by critical partners such as ZEISS Group for optics and KLA Corporation for metrology [3]. Strengthening this supply chain, Lasertec Corporation launched the ACTIS A200HiT Series for photomask and mask-blank inspection in October 2025, addressing the heightened precision requirements of the angstrom era [3].
Strategic Autonomy and Integration
Beyond hardware, the complexity of these systems demands unprecedented collaboration across the European value chain. Imec is currently coordinating the NanoIC pilot line, a European initiative designed to accelerate the adoption of these advanced technologies [2]. Furthermore, acknowledging that hardware excellence requires robust software foundations, ASML has entered a strategic alliance with Bits&Chips and Mikrocentrum to bolster the software community within the Dutch high-tech sector [4]. This initiative, which includes partners like Canon Production Printing and Thermo Fisher Scientific, focuses on challenges such as hardware-software integration and quality assurance [4]. Looking ahead, Geert Vandenberghe, Imec’s VP of R&D for Patterning, is scheduled to present the roadmap for industry insertion at Semicon Korea on 11 February 2026, marking the next phase in this technology’s commercialisation [1].