Dutch Startup Secures €20.7 Million to Solve the Leading Cause of Circuit Board Failures
Eindhoven, Friday 21 August 2026
Eindhoven-based Keiron Printing Technologies has secured €20.7 million to scale its laser-printing technology, which targets the source of 70% of circuit board defects to boost production yields to 95%.
A Breakthrough in Dutch Deep-Tech
In July 2026, Eindhoven-based Keiron Printing Technologies completed a €20.7 million Series A funding round to commercialise its advanced laser-assisted deposition technology [1][2][3]. The investment was co-led by the Dutch state-backed impact investor Invest-NL, which committed €6.9 million—representing 33.333% of the total round—alongside DeepTechXL and Waves Capital [1]. This consortium was bolstered by participation from Ramphastos, TNO Ventures, ATUM Ventures, and Cottonwood Technology Fund [1]. The capital injection is earmarked for technological validation with clients, scaling up their initial systems, establishing a service organisation, and developing the next generation of their platform [1]. Previously, the company secured an Innovation Credit (Innovatiekrediet) from the Netherlands Enterprise Agency (RVO) [1].
Redefining Printed Circuit Board Assembly
Traditional printed circuit board (PCB) assembly has long relied on stencil printing, jet printing, and automated inspection systems to apply solder paste [2][3]. However, solder paste printing is the primary cause of defective circuit boards, accounting for 70% of all manufacturing failures in the industry [2][3]. Keiron’s proprietary technology, known as Laser-Induced Forward Transfer (LiFT), introduces a non-contact deposition method designed to replace these legacy processes with its flagship HF2 LiFT Printer [2][3]. By consolidating multiple mechanical steps into a single digital platform, Keiron aims to dramatically improve manufacturing reliability [2][3].
Unlocking Unprecedented Production Yields
The economic implications of this transition are substantial. Traditional PCB manufacturing lines typically operate at an industry yield of 60% [2][3]. By implementing the HF2 LiFT Printer, Keiron claims it can boost this yield to over 95%, while simultaneously reducing lead times, improving equipment uptime, and accelerating production line programming speeds [2][3]. Maaike Vranckaerts, investment manager at Invest-NL, noted that Keiron’s proposition holds the potential for a genuine breakthrough innovation, completely developed within the Dutch high-tech ecosystem [1].
Strengthening the European Semiconductor Value Chain
Keiron’s innovation arrives at a critical moment for European strategic autonomy and supply chain resilience [GPT]. As the European Union seeks to bolster its semiconductor sovereignty, domestic equipment manufacturing is vital [GPT]. The Netherlands, home to semiconductor giants like ASML and ASM International, plays a central role in this value chain [GPT]. By providing localized, high-precision manufacturing equipment, startups like Keiron strengthen Europe’s ability to package advanced chips and assemble complex electronic assemblies without relying heavily on external supply chains [GPT].
Synergy with Integrated Photonics and Chip Design
This technological development also complements other regional initiatives, such as the integrated photonics cluster led by PhotonDelta, which aims to scale next-generation chip design and manufacturing [GPT]. Integrating advanced packaging technologies like laser-assisted printing with integrated photonics and high-performance chip design is essential for building a robust, self-sustaining European tech ecosystem [GPT]. By bridging the gap between advanced semiconductor design and physical PCB assembly, Keiron’s technology ensures that Europe’s high-tech manufacturing sector remains competitive, sustainable, and resilient against global supply shocks [1][GPT].